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This solution is designed for high-density computing scenarios such as IDC data centers, supercomputing centers, and AI computing clusters. It addresses core pain points such as high-current power supply, high-speed data transmission, strong electromagnetic interference, and high-density cabling, covering the entire chain of server power supply, high-speed interconnection, and rack cabling.
The power supply cables are made of high current-carrying flame-retardant copper cables with low impedance design to reduce heat loss. They also have low smoke and halogen-free flame-retardant properties, making them suitable for the enclosed heat dissipation environment of the computer room. The high-speed interconnect uses 10 Gigabit/400G high-speed fiber optic cables and shielded high-speed data cables. The multi-layer shielding structure isolates power harmonic interference, ensuring low latency and packet loss-free transmission of computing power data.
The cabling adopts a separate cable tray layout for strong and weak current cables, with neat and orderly cable routing within the cabinet and reserved space for heat dissipation to prevent heat buildup in the cables. It is equipped with high-density patch panels, dustproof and waterproof connectors, and uniform labeling for easy operation and maintenance management. Grounding and shielding are carried out throughout the entire process to suppress crosstalk and static electricity accumulation.
The entire solution takes into account the three core requirements of high bandwidth, high current and high security, and is compatible with the 24/7 uninterrupted operation of computing equipment. It effectively reduces the risks of line overheating, signal attenuation and short circuit failure, and supports the long-term stable operation of computing clusters to carry high-load services such as AI training, cloud computing and big data computing, and meets the needs of data center for future computing capacity expansion and upgrade.
